Rely on our expertise for your project in 3D printed circuit board printing:

PHYTEC New Dimensions is a pioneer in the use of technologies for 2D PCB printing and 3D hybrid printing. Already since 2016, we  create functional patterns with the printers of Nano Dimension. As a partner company, we played a key role in its development.

Now we pass on our know-how to you. Choose the optimal feasibility study for your project and your application.

We are looking forward to your challenge!

Proof of Concept

Rely on our experience for your project in 3D printed circuit board printing.

PHYTEC New Dimensions GmbH is a pioneer in using the Additive Printing technologies for 2D Printed Circuit Board (PCB) and 3D Printed Circuit Structure (PCS) printing.

Sample PCB

We print a sample of your own printed circuit board with the additive printing process. So you can experience the particular feasibility of an additively Printed Circuit Board for your project needs.

Technical specifications

  • 2D PCB printing
  • max. size: 36 x 80 mm ¹ 
  • max. PCB thickness: 1.5 mm
  • up to 4 layers
  • min. 150 μm line / space
  • Silver thickness of the signal layer up to 18 μm
  • Via pad 500 μm / hole 350 μm

¹: project-specific customizable values

csm_k-Leiterplatte_Best_C3_BCckt_131977011c.png

Assembled PCB

We assemble your individually printed circuit board. Together we determine your tasks and requirements and evaluate the options and the application range.

Technical specifications

  • additively printed 2D-PCB
  • max. size: 36 x 80 mm ¹
  • max. PCB thickness: 1.5 mm
  • up to 4 layers ¹
  • min. 150 μm Line / Space ¹
  • Silver thickness of the signal layer up to 18 μm
  • Via pad 500 μm / hole 350 μm
  • single-sided assembly with a maximum of 25 components
  • Component size min. 0805
  • No BGA

¹: project-specific customizable values

csm_k-PHYTEC_3D_printed_PCB_9a40bd4f6b.png

Individual Design Study

Together we develop and research the Possibilities of this new additive hybrid Technology. We individually explore the Limits of feasibility from your project and determine the area of application in your company.

Technical specifications

  • additively printed 2D-PCB
  • max. size: 36 x 80 mm ¹
  • max. PCB thickness: 1.5 mm
  • up to 4 layers ¹
  • min. 150 μm line / space ¹
  • Silver thickness of the signal layer up to 18 μm
  • Via pad 500 μm / hole 350 μm
  • single-sided assembly with a maximum of 25 components
  • Component size min. 0805
  • No BGA

¹: project-specific customizable values

k-3D_printed_object_combining_dielectric_and_condu.jpg
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